GapFiller3500S35高导热硅脂高志电子科技销售

Bergquist GapFiller3500S35双组分液态间隙填充导热材料

材料生产商：美国贝格斯（BERGQUIST）公司研发产品

GapFiller3500S35可供规格：

规格(Specifications): 50CC、400CC、1200CC、6gallon

导热系数(Thermal Conductivity)：3.6W/m-k

基材(Reinfrcement Carrier)：硅胶

胶面(Glue)：无

颜色(Color)：蓝色/白色

包装(Pack)：美国原装进口包装

持续使用温度（Continous Use Temp）：-60°~200°

密度（Density）: 3.0g/cc

GapFiller3500S35应用材料特性：

GapFiller3500S35双组分配方便易于储存，触变特性使其容易点胶，超好贴服性，针对易碎和低压力应用设计，室温固化及加速固化

Gap Filler 3500S35 is a two-component liquid gap filling material, cured at either room or elevated temperature, featuring ultra-high thermal performance and superior softness. Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity. The result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external force (e.g. dispensing or assembly process). The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. once cured, it remains a low modulus elastomer designed to assist in relieving CTE stresses during thermal cycling yet maintain enough modulus to prevent pump-out from the interface. Gap Filler 3500S35 will lightly adhere to surfaces, thus improving surface area contact. Gap Filler 3500S35 is not designed to be a structural adhesive.

GapFiller3500S35材料应用：

汽车电子，独立元器件到外壳，PCBA到外壳，光纤通讯设备，印刷电路板组件和外壳之间，光纤通讯设备

GapFiller3500S35技术优势分析：

GapFiller3500S35间隙填充材料提供了卓越的导热性能并且是使用液态点胶设备的理想产品，作为在现场成型的弹性体，针对不平整的板子起伏，他们的很好贴服性特性提供了很大的厚度覆盖。他们理想的应用于易碎的和低应力应用场合，比如电源电子和独立元器件。他们的低粘性可以确保点胶设备在压力较低的情况下，提供更快的流量，压力过高会使胶类分解且影响机械性能。固化后，形成干的可触摸的表面，没有固化副产物，可以得到干净的装配件。